Parama Networks Aligns with UMC for Production of World's First ADM-on-a-Chip; Innovative SoC Achieves First-Pass Silicon Success on 0.13 Micron Process
SANTA CLARA, Calif. & HSINCHU, Taiwan—(BUSINESS WIRE)—Jan. 21, 2004—
Parama Networks, a fabless semiconductor company
specializing in SoCs for the telecommunications transport equipment
market, and UMC (NYSE:UMC), a leading global semiconductor foundry,
today announced that the two companies have achieved first-pass
silicon success of the industry's first ADM-on-a-Chip(TM) (add-drop
multiplexer). Parama's new SoC for SONET/SDH architectures, introduced
earlier this month (see
http://www.paramanetworks.com/news/pr_jan05.shtm), is built on UMC's
0.13 micron process.
"Parama required close collaboration with its foundry provider to
ensure we would deliver our innovative, high-quality chip to meet the
needs of our sophisticated customer base of network equipment
providers," said Hemant Bheda, CEO of Parama Networks. "We are
thrilled with our selection of UMC as our foundry provider as we
realized working silicon the first time out; no costly changes to the
mask were required."
Fu Tai Liou, head of the America Business Group at UMC said, "Our
efforts with Parama demonstrate how our emphasis on close customer
partnerships is helping them achieve excellent silicon results on deep
submicron processes within short market windows. The development of
Parama's ADM implemented on a single piece of silicon is a significant
feat for both companies. We are eager to continue working with Parama
on further innovations that target the communications market."
About Parama's ADM
The ADM-on-a-Chip offers -- for the first time on a single piece
of silicon -- all of the functions necessary to build an ADM and other
next-generation-network equipment, including cross-connect, line and
tributary framers, and overhead processing. The SoC features an
elegant architecture that simplifies the equipment design process,
creates dramatic reductions in cost and power while providing
scalability, flexibility, density and simplicity in building the next
generation of data-aware SONET and SDH systems.
About Parama Networks
Parama Networks is a fabless semiconductor company specializing in
System-on-a-chip solutions for the telecommunications transport
equipment market. The company was funded in March 2001 with support
from Azure Capital Partners, Cross Bridge Ventures, Menlo Ventures,
Network Angel Capital and Sprout Group. Parama's unique products
enable equipment vendors to deliver innovative products with faster
time to market, and reduced cost, power and size. Led by a management
team that has many years of experience in system-on-a-chip product
development, SONET/SDH system design, software development, and
marketing, the company has received 3 U.S. Patents and has 22 others
pending.
About UMC
UMC (NYSE:UMC)(TSE: 2303) is a leading global semiconductor
foundry that manufactures advanced process ICs for applications
spanning every major sector of the semiconductor industry. UMC
delivers cutting-edge foundry technologies that enable sophisticated
system-on-chip (SOC) designs, including 90nm copper, 0.13um copper,
embedded DRAM, and mixed signal/RFCMOS. UMC is also a leader in 300mm
manufacturing; Fab 12A in Taiwan is currently in volume production for
a variety of customer products, while Singapore-based UMCi is now in
pilot production. UMC employs over 8,500 people worldwide and has
offices in Taiwan, Japan, Singapore, Europe, and the United States.
UMC can be found on the web at http://www.umc.com.
Contact:
UMC
Alex Hinnawi, 886-2-2700-6999 ext. 6958 (Taiwan)
alex_hinnawi@umc.com
or
KJ Communications (for UMC)
Eileen Elam, 650-917-1488 (USA)
eileen@kjcompr.com
or
LouVan Communications, Inc. (for Parama Networks)
Michael Newsom, 508-541-9036
mnewsom31@comcast.net
